For decades, the U.S. has set the global semiconductor roadmap with Moore’s Law, driving progress by shrinking transistors. Now Huawei is trying to rewrite the rulebook.

数十年来，美国依托摩尔定律主导全球半导体发展路线，依靠缩小晶体管尺寸推动行业进步。如今，华为正试图改写这一行业规则。

Its new “Tau Law” shifts the focus from geometric scaling (making transistors smaller) to time scaling (cutting signal delay across chips and systems).

华为提出的全新韬定律（τ定律），将技术重心从几何缩放（缩小晶体管体积）转向时间缩放（削减芯片及系统内的信号延迟）。

The move is a direct response to U.S. sanctions that blocked Huawei from advanced EUV lithography. By prioritizing logic folding and 3D stacking, Huawei aims to match 1.4nm-class performance by 2031 without state-of-the-art manufacturing equipment.

此举是华为针对美国制裁做出的直接应对。相关制裁致使华为无法获取先进的极紫外光刻技术。华为以逻辑折叠与三维堆叠技术为核心发展方向，计划在2031年，不依赖顶尖制造设备也能实现对标1.4纳米工艺的芯片性能。

Industry analysts say the Tau Law marks the first time a Chinese company has put forward a complete, alternative paradigm for post-Moore chip design—potentially weakening U.S. control over the global semiconductor agenda.

业内分析师表示，韬定律是中国企业首次提出一套完整的、可替代摩尔定律的后摩尔时代芯片设计体系，或将削弱美国在全球半导体发展规划上的主导权。重点专业词汇注解

1. semiconductor roadmap 半导体发展路线图
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2. geometric scaling 几何缩放（传统芯片制程缩小思路）
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3. time scaling 时间缩放（韬定律核心思路）
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4. EUV lithography 极紫外光刻（高端芯片核心制造工艺）
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5. logic folding 逻辑折叠
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6. 3D stacking 三维堆叠
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7. post-Moore 后摩尔时代